Adaptive Threshold Control in an Autonomous Sensor Field

Not Available Future chip and board level electronics or optoelectronics will require innovative heat removal solutions to enable them to meet size, weight, power, high reliability, and low cost. Commonly, these approaches are based on efficient 2-D and 3-D arrangements of electronics, often involving multi-chip modules (MCMs). As chips are brought closer together, the area/volume power densities and, therefore, heat increases. MS Technology (MST) proposes a new type of heat removal modular device, which will solve electronic packaging problems of future large scale device electronic and optoelectronics systems, like MCMs. This new approach removes the generated heat by first converting it to electricity which could be dissipated in a shunt resistor far from the device or supplement the main system power supply. This supplementary power source further increases reliability, reduces cost and weight of the entire system. MST will evaluate and develop conceptual designs for this new device that should provide significant thermal management improvements compared to the thermal management techniques used in heat removal approaches now. MST will conduct proof of concept demonstrations to indicate the practicality of such techniques for use in device electronic systems. A low cost high performance heat removal modular device, will find commercial application in projects of interest to government, industry and academia, especially with respect to commercial applications. It is also possible in certain circumstances to find applications in other domains, where large amounts of dense circuitry can be confined with limited air flow boundary conditions.