Dielectric Printed Circuit Board Planar Thermosyphon

While solid state lighting (SSL) represents the future in energy efficient and environmentally friendly lighting, certain technological obstacles still must be addressed before SSL can truly compete with incandescent and fluorescent lamps. The thermal management of high brightness (HB) light emitting diodes (LEDs) is one of these critical obstacles, as identified by the DOE. The proposed core technology will dramatically improve on current thermal management strategies implementing an innovative printed circuit board (PCB) heat spreader. Advanced Cooling Technologies, Inc. (ACT) proposes a PCB dielectric planar thermosyphon to maintain a significantly lower LED junction temperature, which not only improves device reliability and lifetime but also enables higher luminous flux LEDs and higher density packing configurations. Phase I and II efforts will be directed towards the development and testing of a prototype integrated with an LED package. . Commercial Applications and Other Benefits: ACT has partnered with Sunovia Energy Technologies, Inc., an LED integrator, to ensure the proposed technology would be commercially applicable if a Phase III award was ultimately awarded. Specifically, ACT envisions the technology used in downlighting applications where the gravity aided orientation enables the thermosyphon effect