THE SICON IS AN INNOVATIVE TECHNOLOGY THAT SOLVES A NUMBER OF PROBLEM AREAS IN MICROELECTRONIC INTERCONNECTION.

THE SICON IS AN INNOVATIVE TECHNOLOGY THAT SOLVES A NUMBER OF PROBLEM AREAS IN MICROELECTRONIC INTERCONNECTION. VLSI CHIPS ARE ATTACHED TO THE SURFACE OF PRINTED WIRE BOARDS WITHOUT THE NEED FOR SOLDER. THIS FORMS A SELF HEALING, THERMAL EXPANSION ACCOMMODATING SYSTEM. THIS METHOD USES SHORT, FLAT, ETCHED INTERCONNECT PATTERNS WHICH ARE USEFUL WITH MICROWAVE CIRCUITS. THE ETCHED MICROINTERCONNECTION PATTERNS HAVE HIGH RESOLUTION AND ARE CAPABLE OF PRODUCING DUAL OR REDUNDANT I/O CONNECTIONS. A SELF HEALING METAL TO METAL SEAL IS PROPOSED THAT WILL FURTHER IMPROVE THE LEAK RATE OF THIS STRUCTURE ALLOWING IT OT QUALIFY AS A TRUE HERMETIC PACKAGE. THE PROPOSED SCOPE OF WORK CONSISTS OF (A) DEFINITION AND DESIGN OF A REPRESENTATIVE TEST SAMPLE TYPE, (B) TEST SAMPLE ASSEMBLY, (C) COST ANALYSIS OF SAMPLE PRODUCTION, (D) TEST EXECUTION, (E) TEST EVALUATION, (F) TECHNICAL AND COST TRADE-OFF ANALYSES, AND (G) PREPARATION AND SUBMITTAL OF A FINAL REPORT.