SBIR/STTR Research Award
EASILY PROCESSED HIGH TEMPERATURE PRIMER/ADHESIVE SYSTEM
Award amount
$56,942Program and phase
SBIR · Phase IAward year
1990Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- Pda Engineering
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
DEVELOPMENT OF REACTIVE PRIMER/MODIFIED PHENOLIC ADHESIVE SYSTEM IS PROPOSED FOR BONDING RADOME MATERIALS. INITIAL STUDIES HAVE SHOWN THAT THE REACTIVE PRIMER CHEMISTRY WILL FORM CHEMICAL BONDS WITH METALS, CERAMICS AND POLYMERS. A TWO-STAGE PRIMER IS PROPOSED THAT CAN BE BONDED TO A RADOME SUBSTRATE AND AN ADHESIVE IN TWO SEPARATE OPERATIONS, EITHER BY TEMPERATURE, ACTINIC LIGHT OR A COMBINATION OF THESE. THE MODIFIED PHENOLIC ADHESIVE HAS EXCELLENT HIGH TEMPERATURE PROPERTIES AND CURES WITHOUT VOLATILE EVOLUTION AT TEMPERATURES NEAR 200 DEG C. THE COMBINATION PRIMER/ADHESIVE SYSTEM CAN BE EASILY PROCESSED TO FORM WELL-ADHERED, HIGH STRENGTH, HEAT RESISTANT JOINTS WITH A VARIETY OF RADOME MATERIALS.
Technology keywords
Not reported