Thermal Microprobe

This project will complete the design and fabrication of a novel high-resolution termal microprobe, and evaluate its potential for measuring the temperature of operating microelectronic components with a temperature resolution of 0.01 C and a spatial resolution of 10 nm. Fabrication is in two major steps: formation of a prototype AFM microprobe, and the addition of a thermocouple junction to the tip of the probe. The first stage has been completed in our subcontractor's lab (at NJIT), and the second stage has been started. This innovative technical approach includes a design for confining a low-mass termocouple junction at the at the tip region only of the probe. The main advantage of this innovative approach is that the microprobe will be able to serve the dual function of an AFM probe for surface imaging, and a thermal microprobe for probing the temperature of very small regions of the sample surface with high resolution. This project is expected to result in a device for measuring surface temperature, with temperature and spatial resolution unobtainable by other means.