A Novel Ultrasonic Technique for Quantitative Bond Strength Assessment

The objective of this proposal is to demonstrate the feasibility of a previously unexplored ultrasonic technique for nondestructive evaluation of adhesive bond strength. The successful completion of this project will lead to a small, portable, and commercial instrument for quantitative assessment of bond quality both as initially fabricated or after being subjected to extreme (hot/wet) environments. Anticipated Benefits: This project will demonstrate the feasibility of a technique which can be developed into a commercial product for bond strength evaluation. Economical, quantitative, simple, inexpensive, and nondestructive measurements will have a great impact on adhesive bond technology in the aerospace, car, semiconductor, and electronic packaging industries, among others.