Enhanced Pulse Power Using Cryogenic Electronics

Phase I will reduce the weight, size, and cost of pulsed power electronic equipment by achieving compact integration of the solid-state semiconductors. A dramatic reduction in waste heat and thermal management problems will be effected, thus eliminating conventional heat sinks, blower fans, etc. Phase I will also offer special advantages in space-based equipment where size and weight are at a premium. Inductors and other components made from high-temperature superconducting wire will offer additional benefits, including enhanced conversion efficiency and weight savings. This technology will be widely applicable to industrial and defense power systems, including industrial power supplies used in welding, induction heating, motor drives, and high-current DC. Such equipment can be made more efficient and less costly. In addition, utility power transmission involving DC links will become more practical and competitive. Future developments will allow multichip integration of solid-state power devices.