Conformable Multichip Assembly Technology

EPIC Technologies proposes to develop a flexible high density multichip assembly technology capable of being bent and twisted to conform to the available space in a constrained military of commercial electronic system. EPIC will adapt its basic chips first multichip assembly technology to meet the requirements of a conformable assembly. EPIC's basic chip first technology has been previously developed and is now being used to produce fieldable portable systems. The technology comprises a high density additive printed circuit technology applied to a substrate containing bare integrated circuit chips. The main goal of the Phase I effort is to demonstrate the feasibility of the conformable technology by producing a prototype. This prototype will consist of existing passive chips which can be connected into daisy chains in the conformable assembly. Prototypes will be designed, fabricated, tested, subjected to bending and torsional stress and retested to confirm the reliability of the connections.A second goal of the Phase I effort is to identify military and commercial applications of the conformable technology. This will be accomplished by reviewing the forthcoming capability with government and commercial entities during Phase I.