APPLICATION OF HYBRID WAFER-SCALE INTEGRATION TO ANALOG ELECTRONICS

WE PROPOSE TH DEVELOP AN INNOVATIVE NEW FORM OF HYBRID WAFER-SCALE INTEGRATION (HWSI) TO REDUCE THE SIZE, WEIGHT AND NOISE LEVELS IN HIGH-PERFORMANCE ANALOG SYSTEMS SUCH AS SPACEBORNE INFRARED SENSOR PREPROCESSORS. IN PARTICULAR, WE WILL EMPLOY SPECIAL HESI STRUCTURES TO SHIELD SENSITIVE DEVICES AND INTERCONNECTS AND TO ISOLATE CIRCUITS FROM NOISE SOURCES. WE WILL ALSO EMPLOY LOW-VOLTAGE LOGIC IN ASSOCIATED DIGITAL CIRCUITRY TO REDUCE BOTH NOISE GENERATION AND POWER CONSUMPTION. THESE APPROACHES WILL ALLOW US TO ACHIEVE AN ORDER OF MAGNITUDE REDUCTION IN THE SIZE AND WEIGHT OF ANALOG PREPROCESSOR SYSTEMS OVER MORE CONVENTIONAL TECHNOLOGIES. IN PHASE I WE WILL CARRY OUT FEASIBILITY STUDIES, COMPONENT EXPERIMENTATION AND PRELIMINARY DESIGNS. IN PHASE II WE WILL FABRICATE AND DEMONSTRATE A MINIATURIZED, LOW-POWER ANALOG SYSTEM UTILIZING THE NEW FORM OF HWSI TECHNOLOGY. WE WILL BE ASSISTED ON A SUBCONTRACT BASIS FOR BOTH PHASES BY AEROJET'S ELECTRNOIC SYSTEMS DIVISION. THIS FIRM IS A LEADER IN THE DEVELOPMENT, MANUFACTURE AND OPERATION OF SPACEBORNE INFRARED SENSOR SYSTEMS, INCLUDING HIGH-PERFORMANCE ANALOG PREPROCESSORS.