Electroformed High Resolution Thick Metal Film for Hyper-Dense Electronic Packaging

20 microns thick metal film deposits at thin film resolutions will ensure densely integrated MCMs essential to advanced electronic devices such as onboard data and signal processing systems (OBDP). 99.8% dense and 99.8% pure monolithic and environmentally stable copper interconnects in analog applications will remove heat and control impedance with 5-10 times capacity. Two to three times higher chip density in digital MCMs will reduce signal amplitude losses, signal ground bounce and clock distribution variation. As digital clock speeds increase, power and ground line impedance can limit dynamic and static noise margins. Compared to conventional devices, ECSI interconnects will extend this limit two to three times. ECSI's proprietary technology will deliver superior products at high yields at reduced cost.