Chip-Level 3D Microelectronics Integration via Electrohydrodynamic Printing for Defense Applications and Beyond

This project explores the integration of Freescale’s advanced electrohydrodynamic (EHD) printhead technology with BotFactory’s additive electronics manufacturing systems. The goal is to enable on-demand, mission-specific electronics fabrication for the Department of the Air Force (DAF), providing a solution that significantly enhances tactical flexibility and operational readiness. By producing chip-level, next-generation, adaptive 3D electronics directly in-theater, this technology will address vulnerabilities in the global semiconductor supply chain and deliver a critical competitive advantage in contested environments. In Phase 1, the project will focus on assessing the early-stage compatibility of the printhead and manufacturing systems. Key technical parameters, including power, signal integrity, and data rate compatibility, will be evaluated through preliminary testing and MVP integration. Feedback from DAF stakeholders will ensure that the solution aligns with strategic defense needs. The outcome of Phase 1 will be a comprehensive roadmap for Phase 2 integration, where the solution will be fully realized and deployed. This effort leverages BotFactory’s experience in additive manufacturing and Freescale’s innovation in EHD printing to create a powerful, dual-use technology capable of serving both defense and commercial markets.