SBIR Phase I: Microwave-Based Interconnect Technique for System-on-a-Package Wafer Level Packaging

This Small Business Innovative Research (SBIR) Phase I Project will adapt localized microwave heating techniques to emerging System on a Package (SOP) interconnect designs. One critical bottleneck in the realization of the next-generation, micro-electronic industry migration to SOP is the need for an interconnect technology that can handle 20 to 100 micron pitch line widths. The objective of this project is to develop bonding recipes around existing tool sets that will allow realization of interconnect designs. The long-term goal of this project is to develop tools that will facilitate rapid prototype development of a next generation SOP designs. The broader impacts of this technology will be tools that will facilitate rapid prototype development of a next generation SOP designs that will be cheaper and much smaller than existing chips.