Improved Thermal Bond Material for Electronic Components

The objective of the proposed program is to design, using graphite fiber fabric, high thermal conductivity thermal doubler/electronic component bonds that can be debonded easily at low temperatures for repair. The design and selection of materials for these bonds will be guided by computer modeling and analysis work. The thermal performance of polymer bond materials reinforced with high thermal conductivity graphite fiber weaves, or tapes, will be modeled and compared to the performance of polymer bond materials containing high thermal conductivity whiskers and particles. The bond design analysis will also consider the effect of different thermal doubler materials, such as carbon-carbon or aluminum, on the overall thermal performance. A prototype sample of the 'optimum' bond material design identified during the analysis and modeling work will be produced as a feasibility demonstration in Phase I. In the Phase I Option effort, the thermal performance of the prototype bond materials will be measured, and the results will be used to validate our computer modeling and analysis work. A detailed final report will be submitted at the end of this Phase I effort.