SBIR/STTR Research Award

Growth of Large Diameter Silicon Carbide Boules

Award identifier 88669121dc654af26b779cd45a3bc588043ac5e8bca69ae9fc0a13b43d4655d2Awarding agency Department of Defense · Missile Defense Agency

Award amount

$750,000

Program and phase

SBIR · Phase II

Award year

2003

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Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
BANDGAP TECHNOLOGIES, INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Absence of low defect density large diameter (~100 mm) silicon carbide (SiC) wafers is a major barrier for the commercial production of SiC-based devices. Hence, the development of a process to produce large diameter bulk SiC boules with low defectdensity offers a significant impetus for the widespread commercialization of SiC-based devices. An approach that will simultaneously increase wafer diameter and decrease defect density is expected to result in SiC-based devices that are larger in diameterand devices with improved characteristics, performance, and yield. In the Phase I program, the feasibility of growing 75 mm diameter 4H-SiC boules with significant reduction in mechanical stress due to boule diameter expansion from smaller diameter seedswas convincingly demonstrated. The objective of the proposed Phase II program is to take the Phase I demonstration of this new approach

Technology keywords

Not reported

Agency intelligence

Department of Defense

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