Microwave Bonded Heat-flux Sensor Array for High Temperature Applications. (Topic: New Thermal Sensors for Use with Inverse Heat Conduction Problems)

"Starting with a proven high-sensitivity, high-density, micro-mechanical electrical system (MEMS) temperature-sensor array design, we propose to make appropriate material substitutions to create a thermal sensor capable of operating in hostile environments,such as at high temperatures, underwater, and in a vacuum. We will then use our patented microwave bonding processing technology to stack these temperature arrays to create robust, low cost, heat flux sensor arrays compatible with flush mounting in thinmaterial substrates. Microwave Bonding Instruments, Inc., was founded to commercialize microwave silicon wafer bonding technology developed at the Jet Propulsion Laboratory (Pasadena, California). The Company's mission is to become the leading provider ofIC, MEMS, and MOEMS assembling equipment for advanced hybrid device applications. MBI is positioning its equipment in the current $2.4 billion die level interconnect equipment niche. Expertise gained from this project will assist MBI in packaging of otherMEMS devices for telecommunications and MEMS fluidic devices valued together at up to $3 billion in 2001."