Cost Effective Copper CVD Precursors for ULSI Devices

Chemical vapor deposition (CVD) of copper for vias and interconnects is critical to manufacture of next generation high speed ULSI devices and has been extensively investigated over the last few years. Although considerable progress has been made commercialization of this technology is currently impossible due to the high cost of the source reagents. In this Phase I program Advanced Technology Materials, Inc.(ATM) will investigate three novel classes of copper precursors specifically designed for synthesis from inexpensive feedstocks. In Phase II the molecular structure of the compounds will be optimized and large scale synthetic methods will be developed. In addition we will collaborate with a major semiconductor manfacturer to integrate the source reagents and ATM's proprietary liquid delivery technology into a commercial CVD reactor. This will lead in Phase III to introduction of a commercial manufacturing process for CVD copper. Anticipated Benefits: Chemical vapor deposition of copper is on the critical pathway for next generation high speed logic devices. The identification of cost effective Precursors for this process will have a profound and immediate effect on logic device fabrication.