IGBT-based 270V Solid-State Power Controller (SSPC) for Joint Strike Fighter Application

VPT Inc. proposes a 270V, high current solid state power controller (SSPC) based on IGBT chip scale embedded power packaging technology and a thick film hybrid controller. This packaging will allow operation over the full military temperature range of-55C to 125C. The SSPC will contain additional features including transient voltage protection to meet requirements typical of Mil Std 704A and EMI filtering typical of Mil Std 461. The controller will provide a current squared-time (I2T) tripcharacteristic. The goal is to provide the SSPC in industry standard half brick and full brick configurations and directly apply the products to the Joint Strike Fighter (JSF) program. The Virginia Tech Center for Power Electronic Systems (CPES) will bea major subcontractor to VPT on this project. CPES brings major expertise in high current IGBT technology. In Phase I, VPT will perform the following: (1) Define requirements for SSPCs on the JSF program, (2) Provide an IGBT-based power stage designusing chip scale embedded power packaging technology, (3) Design an I2T controller that can be packaged in hybrid format, (4) Design spike protection according to Mil Std 704A, (5) Design EMI filtering, (5) Demonstrate the system with a breadboard. TheSSPC developed in this SBIR will have direct application to the Joint Strike Fighter program as well as commercial aircraft