SBIR Phase I: Nanomaterial-Based Room Temperature Conductive Paste

This Small Business Innovative Research Phase I project will enable the development of a lead free electrical conductive adhesive(ECA) with improved mechanical and electrical properties. For the ECA to be electrically conductive, the conducting constituents need to reach a percolation threshold value, such that there is sufficient contact to form a conductive network path. Due to the human health and environmental concerns from the use of tin-lead alloy solders, electrically conductive adhesives (ECAs) are gaining use as an alternative to solder technology in micro-electrical packaging. The successful commercialization of this technology will allow the development of environmentally friendly electronics.