High Thermal Conductivity Polymeric Adhesive

Increasing power levels in electronic systems require improved thermally conductive materials. While polymeric adhesives have the best economics and the lowest processing temperatures for electronic assembly, they have low thermal conductivity. Currently these adhesives cannot be used in the high power applications. As future heat transfer needs increase they will be used less and less. This proposal explores the concept of significantly increasing the thermal conductivity of polymeric adhesives without an increase in cost. The goal is to achieve the thermal resistance of solder with the cost target equal to silver-filled adhesives. A higher thermally conductive adhesive that would be broadly applicable to commercial electronics.