Veritcally Integrated Multichip Modules

Multichip modules (MCMs) have allowed the microelectronics industry to produce relatively small, highly-integrated circuitry with performances that far exceeds that of other packaging technologies such as separately packaged ICs soldered onto a printed circuit board. Bare dies are packaged together on a small substrate area, resulting in higher chip densities and shorter interconnects, and therefore allowing for superb clock speeds. In the foreseeable future, the demand will continue for increased integration, improved performance, and smaller footprints with the envisioned circuits incorporating more and more diverse devices and capabilities such as sensors and actuators, diagnostics, and prognostics. Future MCMs will find use in many varied markets extending from the military to the consumer. Optical E.T.C., Inc. proposes to exploit silicon micromachining technology to develop and demonstrate a cost-effective, reliable, and broadly-applicable vertical integration of a multichip module. Phase II efforts would extend development to maximize circuit density and structural robustness, and to address power management issues. Anticipated Benefits: A technology for vertically integrating multichip modules would benefit both military and commercial users. The electronic industry can achieve novel "Personal" and highly portable systems by taking advantage of the increased integration, improved performance, and lower footprint offered by a vertically integrated multichip module.