A RAPID PROTOTYPING ENVIRONMENT FOR PACKAGING AND OTHER TECHNOLOGY ISSUES

THIS PROPOSAL PRESENTS IDEAS AND A PLAN OF NEW TECHNOLOGY DEVELOPMENT FOR ADDRESSING PACKAGING AND OTHER TECHNOLOGY ISSUES IN ELECTRONIC SYSTEM DESIGN. THE PROPOSED WORK HAS AS ITS OBJECTIVE, THE IMPLEMENTATION OF A RAPID PROTOTYPING ENVIRONMENT THAT CONSISTS OF A SET OF TOOLS SUPPORTING HARDWARE DESIGN MEETING SPECIFIC RELIABILITY, PACKAGING, AND PERFORMANCE CONSTRAINTS. IT SUPPORTS ADDING CHANGES, CHANGING MODULARITY, REUSE, ABSTRACTION, AND CONSTRAINT PROPAGATION, FEATURES THAT ARE NECESSARY IN ANY RAPID PROTOTYPEING ENVIRONMENT. THE PROPOSED ENVIRONMENT WILL BE BUILT AROUND A HIERARCHICAL GRAPHICAL TOOL THAT WILL BE USED TO DEVELOP LAYERS OF HARDWARE DESCRIPTIONS INVOLVING INTERCONNECT, PACKAGING, AND PERFORMANCE DATA.