Electrically Medicated Microetching Manufacturing Process to Replace Emersion and Spray Etching

70349 Large printed circuit boards of interest to the Department of Energy require improved manufacturability. In this project, an electrically mediated etching technology will be developed to replace emersion and spray etching techniques. 50 ¿m lines and spaces will be consistently etched using conventional print and etch process equipment and materials. The electrically mediated approach, in conjunction with an improved electrochemical etching cell design, will provide a cost-effective solution for improved electronics module designs. In Phase I, an improved electrochemical cell design will be developed in conjunction with electrically mediated etching of test panels. Commercial Applications and Other Benefits as described by the awardee: Today, products with physical attributes below 75 ¿m line and space experience low process yields (approx 70%). A 50 ¿m line and space capable process would increase yields, lower manufacturing costs, reduce material consumption, utility consumption, reduce costs to the OEM, and provide a technology advancement that would allow higher density packaging at the printed circuit board level.