PIBO Dielectric Film for Advanced Microelectronics Packaging

Electronics products in applications including mobile communications, work stations, small computers, automotive controls, and aerospace and military weapons systems are moving relentlessly toward smaller, thinner, and lighter formats in lower costpackages. Interconnect density requirements in these products are rapidly outstripping that which is achievable through fabrication of traditional multilayer printed wiring boards derived from currently available dielectric materials.Polyimidebenzoxazole (PIBO) film has low dielectric constant, low dissipation factor, low CTE, and excellent dimensional stability. These properties are a near-perfect match with requirements for dielectric substrates for next generation electronicspackaging.PIBO dielectric film would offer significant advantage for use as a superior dielectric substrate for use in primary (chip scale, flip chip, ball grad array) or secondary (motherboard) packaging of integrated circuits. Potential end useapplications include high frequency (microwave, mobile communications, digital) and high-end MLPWBS. Market potential for PIBO film in these applications exceeds $200 million per year.