Liquid Metal Cluster Ion Source For Repair Of Packaging

WE PROPOSE THE DEVELOPMENT OF A DIRECT METAL ETCH AND WRITE (DMEW) TECHNOLOGY BASED ON RECENTLY DEVELOPED LIQUID METAL CLUSTER ION SOURCES (LMCIS) FOR REPAIR OF CONDUCTING PATHS IN POLYCERAMIC SYSTEM. THE LMCIS'S ADVANTAGES OVER COMPETING DIRECT WRITE TECHNOLOGIES INCLUDE HIGH DEPOSITION RATE, NO PRE- OR POST-PROCESSING, GOOD ADHESION AND ALMOST BULK METALLIZATION RESISTIVITY. THIS HIGH THROUGHPUT AND LOCALLIZED DEPOSITION CAPABILITY WILL ENABLE TJIS TECHNOLOGY TO BE USEFUL IN OPTICAL TEST AND REPAIR OF MULTI-LAYER DENSITY INTERCONNECT SUBSTRATES POPULATED MCMs, BARE DIE BUMPING, AND PERSONALIZATION OF SEMI-CUSTOM MCMs. THE OBJECTIVE OF THIS PROJECT DURING PHASE I ARE TO DEMONSTRATE THE FEASIBILITY OF THIS PATENTED AND PROPRIETARY DIRECT WRITE TECHNOLOGY FOR REPAIR OF CONDUCTING PATHS IN POLYCERAMIC SYSTEM. DURING PHASE II, WE WILL DEVELOP A PRODUCTION WORTH DMEW TOOL AND RRELATED PROCESS TECHNOLOGIES FOR METALLIZATION REPAIR.