ON-CHIP TEMPERATURE COMPENSATION FOR ADVANCED MMICS

DEVELOPMENT OF EFFECTIVE ON-CHIP TEMPERATURE COMPENSATION FOR GAAS MMICS (MONOLITHIC MICROWAVE INTEGRATED CIRCUITS) IS OF VITAL IMPORTANCE TO THE IMPLEMENTATION OF THIS TECHNOLOGY IN MICROWAVE SYSTEMS. A PROGRAM TO DEVELOP ON-CHIP TEMPERATURE COMPENSATION TECHNIQUES FOR GAAS MMIC TECHNOLOGY IS DESCRIBED IN THIS PROPOSAL. USING THESE TECHNIQUES THE SYSTEM ENVIRONMENTAL REQUIREMENTS AND MMIC TECHNOLOGY CAPABILITIES ARE COMBINED TO OPTIMIZE PERFORMANCE WHILE MINIMIZING THECOST IMPACT ON PRODUCTION COMPONENTS AND SUBSYSTEM CHIPS. PHASE I OF THE PROPOSED PROGRAM CONCENTRATES ON THE ASSESSMENT AND DESIGN OF SEVERAL PROMISING ON-CHIP TEMPERATURE COMPENSATION TECHNIQUES. FABRICATION AND OPTIMIZATION OF THE COMPENSATION CIRCUITS IN PHASE II LEADS TO A WIDE RANGE OF POSSIBLE MMIC COMPONENTS SUITABLE FOR OPERATION IN THE HARSH ENVIRONMENTS COMMONLY ENCOUNTERED IN MOST MILITARY AND COMMERCIAL APPLICATIONS.