Use Of Novel Momentum Transfer Technology And CFC Replacement Solvents For All-dry Photoresist And Wafer Cleaning

A 6-month, Phase I Small Business Innovation Research (SBIR) program is proposed to conduct proof-of-principle work on a novel process which uses momentum transfer mechanisms and liquid carbon dioxide for all-dry wafer cleaning. Under an earlier, Phase I project, the basic principle of momentum transfer has been demonstrated as effective, using high purity liquid carbon dioxide sprays accelerated by high pressure, dry, filtered air. Test coupons of polished silicon wafers were used, with particulate contamination and finger prints as materials to be removed. Continuation of this line of approach has been proposed in a Phase II application. Newer, proprietary approaches to momentum transfer are described in the present Phase I application, with refinements which should provide some potential improvements in purification and filtration demands, materials conservation and spray control. This approach appears to be adaptable to processing of VLSI materials and silicon substrates, and carries substantial advantages in comparison with supercritical fluid/US technologies for these applications. ANTICIPATED BENEFITS: Substitution of CO2 for CFC-113 in cleaning of electronic and mechnanical parts will have on impact on the order of 19% of the billion kilograms of CFCs consumed on the global market (1986) estimate). These solvents are used domestically to produce about $5 billion in goods. Beneficial impacts on aerospace, biotechnology and electronic industries can come if bening, effective and low cost solvents are identified.