Novel technological process for manufacturing of layered composite materials for electronic thermal management applications

Directly Bonded Copper (DBC) is one of the CTE matching materials that is being widely used for IGBT power modules, power hybrids, smartpower building blocks, solid state relays, electronic heating devices and as building blocks for automobile, militaryand aerospace electronics. Existing methods for fabrication of that material are very expensive. A new method for fabrication of copper/AlN/copper is proposed. That method will allow significant reduction in cost without sacrifice in thermal and electricalproperties of that material. This method will also have significant technological advantages over existing methods. These two factors combined will not only allow to substitute DBC with the copper/AlN/copper composite material produced by using this newmethod in existing applications but will also enable to use that composite for new products. The main anticipated benefit is development of a new process for fabrication of copper/AlN/copper layered composite materials. New fabrication process will allowsignificant cost savings compared to the existing methods of fabrication for that composite material.