Enabling Photosensitive Polymer Technology for Additive MCM-L

Phase I will develop a novel photosensitive polymer dielectric which would allow MCM-Ls to be produced reliably, and with high yields through a sequential multilayer additive process. This material would be developed from novel polymer precursors which have demonstrated the positive attributes of polyimides as well as the potential for zero shrinkage upon cure, low processing temperatures compatible with polymer laminates, and low moisture absorption leading to stable dielectric constants. It is proposed that these exiting new precursor materials be developed specifically to meet the needs of implementing this technology. It is anticipated that this work will provide a novel photo-imageable dielectric material which will be ideally suited to sequential multilayer additive fabrication of MCM-Ls. This technology has the potential to reduce the costs of high density MCMs by orders of magnitude.