HIGH RESOLUTION DIMENSIONAL-CONTROL-SENSORS FOR MICROELECTRONICS MANUFACTURING PROCESS

The objective of this effort is to develop a multitude of process control sensors necessary to cover the entire spectrum of microelectronics process control needs. These non-contact sensors will have the speed, the resolution, the compatibility, and close loop capability for process control feedbacks. Simpex, through its past efforts with the U.S. Army, has successfully developed a wide variety of dimensional/process control sensors and techniques for monitoring and detecting a majority of mocroelectronics process needs. These intelligent sensors include structured illumination, custom optics, high resolution encoders, intelligent system controllers, software routines and drivers that control these sensors. In order to complement the full spectrum of process control needs for microelectronics manufacturing, additional sensors were identified and proposed in this effort. Simpex, through a Tech-Transfer/Cooperative effort with the Idaho National Engineering Laboratory, Department of Energy is proposing to develop a Laser Ultrasonics Measurement Sensor. This sensor technology is non-contact, can monitor minute drifting of manufacturing processes in microseconds, to the precision of 0.02 microns, and will have the intelligence to provide feedbacks for real-time dimensional control of microelectronics manufacturing processes. Other sensors such as Micro-Leveling Sensors and Illumination Calibration Sensors will also be developed under this proposed effort. These added sensors will complement the previously developed sensors to support the entire spectrum of sensor needs.