SBIR/STTR Research Award

Nanostructured Interfaces for Fusion Energy Systems

Award identifier 4bdd35fb4d9fe9c6bb1188beefe527d103e39e39b9f536d4c69e7cd7061f6359Awarding agency Department of Energy

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

2008

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
Technova Corporation
Proposal award date
Not reported
Contract end date
Not reported
UEI
FRD7KFVMNYF8
Solicitation number
DE-PS02-07ER07-36
Topic code
31 a

Research abstract

Fusion energy systems impose tremendous surface heat fluxes that must be transferred to and dissipated by heat sinks. Heat transfer from source to sink encounters particularly high thermal resistance and severe thermo-mechanical challenges at the interfaces between different materials along the thermal path. For example, thermal fatigue and fracture are commonly encountered at such thermal interfaces as the hot isostatic pressing (HIP) joints between plasma facing materials and heat sinks. The exceptional thermal conductivity, strength, ductility, and thermal stability of a variety of nanomaterials (e.g., carbon nanotubes, tungsten nanowires, and boron nitride nanotubes) have prompted interest in the development of nanostructured thermal interfaces. This project will develop a versatile class of nanostructured interfaces that can meet the thermo¬mechanical demands on joints between plasma facing materials and heat sinks in fusion energy systems. Phase I will assess the theoretical potential of nanostructured interfaces, develop production methodologies, and determine the key performance attributes of nanostructured interfaces in simulations and in the laboratory. Commercial Applications and other Benefits as described by the awardee: The new coating technology would complement the worldwide efforts toward realizing the unique advantages of fusion as an alternative energy source. Escalating thermal management problems in electronics also could be addressed by the proposed technology. The estimated market size for nanostructured thermal interfaces in semiconductor packaging is close to $50 million per year.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

40 SBIR/STTR records share this UEI (2002–2012). Reported award amounts total $11,962,241. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Environmental Protection Agency, Department of Energy, Department of Agriculture, National Science Foundation, National Aeronautics and Space Administration

Agency intelligence

Department of Energy

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