SBIR/STTR Research Award

In Situ Remediation of Heavy Metals Using Surfactant Foams

Award identifier da0a971c5ac4f3988f1d53d98c9e77252a767bfd0f316578fdbd8369e76a280eAwarding agency Department of Energy

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

1999

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
Envirogen, Inc.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Not Available Large scale integrated systems are often plagued by sneak conditions because they are comprised of several different components that are designed independently by different groups. Design reuse, cross-pollination of requirements, insufficient system component modeling, continual requirements changes and inherent design process weaknesses make sneak paths more likely to occur and more difficult to detect in these complex systems. Software sneak paths in particular are typically not caught by evaluation or test, resulting in operational errors and outright failures in fielded systems. Sneak Circuit Analysis (SCA) is a proven process that eliminates unwanted paths in electronic systems and has been successfully applied to Software Sneak Path Analysis (SSPA). STi proposes to study present design process and available case reports of integrated combat and warfare systems to identify root causes of software sneak paths. Based on our research, coupled with our extensive SCA experience, we will: (1) recommend changes to design procedures and processes; (2) determine whether analysis techniques can be developed around existing models; (3) identify minimum system modeling requirements; and (4) define requirements for software tools to be developed and tested in Phase II that have potential to eliminate the hidden effects and enable designers to focus on performance.

Technology keywords

Not reported

Agency intelligence

Department of Energy

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