SBIR/STTR Research Award
Multilayer In-Rush Current Limiters
Award amount
$64,966Program and phase
SBIR · Phase IAward year
2001Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- Nanomaterials Research LLC
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
This Phase 1 SBIR project seeks to demonstrate the feasibility of producing multilayered in-rush current limiting devices based on materials that exhibit a negative temperature coefficient of resistance (i.e., NTC thermistors). As microelectronic systemscontinue to proliferate, the need to protect microprocessors from damage due to over-voltage and over-current conditions has created a rapidly growing market for circuit protection devices. At this time, most of the devices used in these applications areleaded ceramic disks. These components are often the largest component on the circuit boards and in many cases require the circuit to be fabricated using a combination of automated (e.g., pick-and-place) and manual operations.The proposed research aims to demonstrate a new chip-style, in-rush limiter with superior characteristics to state-of-the-art devices, transitioning this technology into products that are compatible with modern circuit manufacturing technologies. Theproposed work builds on the company's extensive experience in the design and fabrication of novel circuit protection devices using advances in materials science. If successful, these components will complement our portfolio of multilayered circuitprotection devices.Circuit protection devices are needed in both military and commercial applications to defend microprocessors and other electronic components from in-rush currents. The proposed work will demonstrate the feasibility of producing a multilayer device withsuperior performance characteristics as compared to the currently available leaded devices. It is anticipated that this approach to device design will offer (1) improved performance in a multilayer package, (2) reduced component size, (3) tailorable baseresistance values through multilayer designs, and (4) compatibility with pick-and-place (e.g., tape-and-reel) manufacturing of electronics.Examples of military and civilian application of the proposed technology include use in communication satellites, antennas, computers, navigation and weapon control systems, and voice encryption systems.
Technology keywords
Not reported