IMPROVED CONCEPTS TO REDUCE THERMOSHOCK EFFECTS IN ELECTRONICS (ANALYSIS AND EXPERIMENTS)

MISSION RESEARCH CORPORATION PROPOSES A PHASE I SBIR EFFORT TO EVALUATE THE POTENTIAL FOR THE DEVELOPMENT OF ELECTRONIC PACKAGES WHICH POSSESS SIGNIFICANT IMPROVEMENTS IN HARDNESS TO THERMOCHANICAL EFFECTS. BASED UPON PRELIMINARY STUDIES AND HYDROCODE CALCULATIONS CONDUCTED BY MRC, WE BELIEVE THAT INNOVATIVE ELECTRONIC PACKAGE CONCEPTS CAN BE DEVELOPED WHICH WILL SIGNIFICANTLY REDUCE THE THERMOMECHANICAL SHOCK EFFECTS GENERATED IN THE ELECTRONIC DEVICES. THESE CONCEPTS ARE BASED UPON THE SELECTION OF STRESS WAVE COMPATIBLE ATTACHMENT AND SUBSTRATE MATERIALS, AND AN OPTIMIZATION OF THE GEOMETRY AND THICKNESS BASED UPON THE THREAT ENVIRONMENT. ANALYSES WILL BE CONDUCTED TO OPTIMIZE POTENTIAL PACKAGES AND MATERIALS, AND TESTS WITH ABOVE GROUND SIMULATORS WILL BE PLANNED. TEST PLANS AND APPROACHES WILL BE PREPARED FOR PHASE II TO BOTH EVALUATE AND VALIDATE THE METHODOLOGY AND TO TEST SPECIFIC HARDWARE CONCEPTS. THE SIMULATORS WILL BE CAREFULLY SELECTED IN ORDER TO PROVIDE THE PROPER LOADING CONDITIONS AND TO PROVIDE AN EXPERIMENT OF HIGH "FIDELITY". THIS PHASE I EFFORT WILL CULMINATE IN THE PREPARATION OF A PROGRAM PLAN FOR FURTHER ANALYSIS AND DEVELOPMENT/VERIFICATION TESTING TO BE ACCOMPLISHED IN PHASE II.