AUTOMATED DIE BOND INSPECTION SYSTEM USING MACHINE VISION

THE OBJECTIVE OF THIS PROGRAM IS TO DEVELOP ADVANCED AUTOMATED INSPECTION SYSTEMS WHICH UTILIZE-MACHINE VISION SENSING AND PROCESSING TECHNIQUES TO INSPECT HIGH-RELIABILITY MICROELECTRONICS FOR CRITICAL NAVY APPLICATIONS. THE PROPOSED AUTOMATED SYSTEMS WILL ADDRESS VISUAL INSPECTION TASKS WHICH ARE NOW PERFORMED MANUALLY. THESE INCLUDE DIE BOND INSPECTION, CHIP PLACEMENT AND ORIENTATION VERIFICATION, WIRE CONNECTIVITY INSPECTION, ETC. PHASE I TASKS MAINLY INCLUDE: A BRIEF REVIEW OF RELATED WORK; AN ANALYSIS OF APPLICATION REQUIREMENTS PARTICULARLY FOCUSING ON NAVY-S NEEDS AND APPLICABLE MILITARY MICROELECTRONICSWORKMANSHIP STANDARDS; AN INVESTIGATION AND PROTOTYPING OF APPLICABLE VISION SENSING AND VISION PROCESSING APPROACHES; AN EVALUATION OF ALTERNATIVE SUCH APPROACHES AND SELECTION OF MOST PROMISING ONES FOR FULL IMPLEMENTATION UNDER PHASE II; AND DEVELOPMENT OF A PRELIMINARY SYSTEM DESIGN ADDRESSING OVERALL SYSTEM HARDWARE AND SOFTWARE ARCHITECTURE AND ISSUES SUCH AS USER INTERFACING, PART PROGRAMMING, CAD INTERFACING, INTEGRATION WITH OTHER SYSTEMS IN THE ASSEMBLY LINE, ENCODING OF APPLICABLE STANDARDS, ETC. THE SYSTEM PROTOTYPES IN BOTH PHASES I AND II WILL BE DEVELOPED USING ADVANCED STATE-OF-THE-ART MACHINE VISION SYSTEMS. 0N THE BASIS OF THE ABOVE WORK, NEEDS FOR FUTURE R&D WILL BE IDENTIFIED AND THE PHASE II EFFORT WILL BE PLANNED.