A Multi-Representation Architecture for STEP AP-210-based PCB Stackup Design and Warpage Analysis

The objective of this Phase 1 effort is to demonstrate the feasibility of printed circuit assembly (PCA) warpage simulation through a novel combination of advanced AP210-based printed circuit board (PCB) simulation methods and cutting-edge general-purpose mesh generation tools. Our proposed solution, the extended multi-representation architecture (MRA), embodies an innovative approach that combines rich product models based on open standards, idealization knowledge capture, advanced analytical modeling and FEA meshing, and modular architecture. The specific technical aims are to demonstrate the effective integration of MRA and advanced meshing approaches, evaluate the required fidelity of PCB and component models, and compare the simulation results for s simple board-component assembly with experimental results using temperature-dependent shadow moir¿. COMMERCIAL APPLICATIONS: Evaluation and correction of PCB warpage at the design stage offers major improvements in manufacturing yield and reliability of electronic products. The integration of warpage analysis tools with established ECAD and MCAD software through a standards-based engineering framework offers benefits of speed and efficiency in new product development. The new tools could be sold as part of a larger product lifecycle management (PLM) system for large OEMs and their subcontractors, or as a freestanding web-based engineering service for small or low frequency users.