Monolithically Integrated Pyroelectric IR Sensors of High Performance and low cost

This proposal addresses the fabrication of a novel uncooled pyroelectric IR detector array having significant spectrum coverage (from UV to far IR), size, weight, and cost advantages over the current ones. The innovation is based on the utilization of pyroelectric thin films of high figures of merits and monolithic integration technology. The proposed thin film membrane device structure allows the optimum IR detector array design. A substantial reduction in fabrication cost is anticipated from the elimination of both wafer thinning and solder bump bonding associated with the current state-of-art. This technology development is particularly suited to meet the applications that require broader spectrum coverage, smaller weight and size, higher resolution and sensitivity, lower power consumption, and higher reliability. This Phase I project will demonstrate the feasibility of the proposed approach by an initial growth of new pyroelectric films of PbScl/2Tal/2O3 on Si via an innovative low temperature plasma-enhanced chemical vapor deposition (PE-CVD) process. The PE-CVD may become the best choice to produce large IR detector arrays in sufficient qualities and at low enough cost to facilitate widespread use of infrared sensing systems. In Phase II prototype devices will be produced. Success in the Phase I effort will identify a viable manufacturing route for advanced uncooled IR imaging array fabrication. These devices have a wide range of "dual use" applications, from various DoD's space-based applications to commercial applications of fire fighting, law enforcement, industrial control, and drivers aid.