Substrate Applications in Electronic Packaging

Substrate materials for high performance packaging in microelectronics require thermal expansion matching to Si and GaAs chips, low dielectric constants, and processing temperatures compatible with thick film technology. Other requirements may include integrated packages incorporating a level of intelligence or multi-functionality ("smart" materials); or high temperature packaging incorporating wide bandgap semiconductors including SiC and diamond. TRS will research ceramic substrate materials in the NaZr2P3O12 (NZP) -based family of materials. This compositionally diverse family offers the ability of thermal expansion tailoring from positive through negative values. Based on the selection of low polarization cations and NZP's open structure and high molar volume, ultra-low dielectric constants may result. Further tailoring of key packaging parameters will be demonstrated through the use of glass-ceramic composite concepts. Ultimately, specific tailoring will allow novel integrated packaging.