Self-Contained Distributed Cooling Module for High Heat Sources

MicroEnergy Technologies, Inc. (MicroET) is proposing to develop a self-contained and autonomous thermal management system for distributed cooling of microelectronics. The problem of managing the heat load from multiple discrete heat sources within electronic systems is becoming a growing problem and receiving attention not only at NASA but at DoD and within the commercial sector. In this project, we have demonstrated the feasibility of developing a state-of-the-art autonomous cooling module that could be used in a network for thermal management of discrete and distributed electronics. The cooling module takes advantage of liquid cooling, pumped with a highly efficient built-in micropump integrated within the cooling module, to deliver more than 100 W/cm^2 of cooling. The two critical components, the heat sink and the liquid transport pump, were tested, integrated in a single package and independently for phase I feasibility demonstrations. For Phase II, MicroET is teaming with the University of Washington and Technology Assessment and Transfer (TA&T) to develop and demonstrate a breadboard prototype during the first year followed by a brassboard prototype made of a ceramic monolith structure during year 2 of the project. Our team brings to the table expertise in system engineering and development, fluid dynamics and heat transfer, and ceramic microfabrication. As described in the commercialization section of this proposal we have developed necessary partnerships and intellectual property to successfully manufacture and commercialize our electronics cooling products during phase III.