ADVANCED PACKAGING ASSEMBLY FOR VLSI DEVICES

PRESENTLY THERE ARE MANY PROBLEMS WITH THE AVAILABLE IN THE MARKET. THIS RESEARCH PROJECT PROPOSES A VLSI PACKAGING SYSTEM WHICH CAN PROVIDE ENHANCED THERMAL MANAGEMENT BECAUSE OF THE USE OF SPUTTERED ALUMINUM NITRIDE, COPPER CLAD INVAR CORE MATERIAL IN THE SUBSTRATE AND TAB TECHNOLOGY. THE PACKAGING SYSTEM ALSO ENHANCES THE ELECTRICAL CHARACTERISTICS OF THE VLSI DEVICES BECAUSE OF AN INTEGRATED DECOUPLING CAPACITOR AND TAB BONDING. OTHER ADVANTAGES OF THE SYSTEM ARE COST REDUCTION, HIGH RELIABILITY AND GREATER STRUCTURAL STRENGTH. FIVE EMERGING TECHNOLOGIES ARE USED IN THE SYSTEM: COPPER CLAD INVAR CORE MATERIAL, TAB BONDING, SPUTTERED ALUMINUM NITRIDE, GLASS BEADED KOVAR AND THIN FILM HERMETIC SEALING. THE RESEARCH PLAN CALLS FOR DESIGN, DEVELOP, PROTOTYPE TESTING, EVALUATION AND ASSESSMENT OF THE SYSTEM. THE TEST PLAN USES BOTH MIL SPEC AND SPECIAL TESTING.