SBIR/STTR Research Award
Microwave 3DIC-Microwave Three Dimensional Integrated Circuit
Award amount
$749,989Program and phase
SBIR · Phase IIAward year
1998Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- AMCOM Communications, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- C39RBB9R1KD1
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
The 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 technical objective is to assess the feasibility of microwave 3DIC concept and to develop a road map for the realization of practical microwave 3DICs for both commercial and military applications.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- High Power Ka/Ku Dual-Band mm-wave Power Amplifiers
- Trust in Temporary Groups
- High Power Ka/Ku Dual-Band mm-wave Power Amplifiers
- Microwave 3DIC-Microwave Three Dimensional Integrated Circuit
Research funding history
5 SBIR/STTR records share this UEI (1997–2009). Reported award amounts total $2,425,595. Reported amounts are not federal obligations.
Phases: Phase II, Phase I
Agencies: Department of Defense