SBIR/STTR Research Award

FUNCTIONALLY GRADIENT ELECTRONIC HEAT SINK MATERIALS

Award identifier 165d77397418e12eb10481b9741ceb714e91309c485c5850bfb3c897d65ad1aaAwarding agency Department of Defense · Navy

Award amount

$49,963

Program and phase

SBIR · Phase I

Award year

1990

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
CORDEC CORP.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

RELIABILITY AND CIRCUIT DENSITY OF STANDARD ELECTRONIC MODULES (SEM) CAN BE INCREASED SIGNIFICANTLY BY TAILORING THERMOPHYSICAL PROPERTIES OF THE HEAT SINK MATERIALS. NEWLY DEVELOPED TECHNIQUES FOR MANUFACTURING METAL MATRIX COMPOSITES (MMC) BY VAPOR DEPOSITION METHODS WILL BE USED TO DEMONSTRATE LIGHT-WEIGHT, HIGH-PERFORMANCE HEAT SINKS HAVING THERAML CONDUCTIVITIES IN EXCESS OF 300 W/M-K AS WELL AS COEFFICIENTS OF THERMAL EXPANSION (CTE) OF 6-7 PPM PER DEGREE CELSIUS.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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