Design and Prototyping of free space optical interconnects packaged compatible with electronic assembly

A packaged optoelectronic interconnection module consisting of at least 64 parallel interconnections between two stages of optoelectronic devices will be demonstrated in Phase I (including option). The packaging technology to be employed for the demonstration will be highly compatible with the existing electronic packaging technology of multi-chip modules on printed circuit board (PCB). Therefore, the resulting packaged interconnection module will be rugged, compact and low maintenance allowing field replacement to the overall assembly. it will involve replace many high speed signal distribution layers in the PCB by one highly multimode waveguide (which can be called free space) in photopolymer, with recorded volume holograms to couple light from one smart pixel to another. By adopting free-space optical interconnection technology, more interconnectivity (>256) among optoelectronic devices can be achieved, the layout of interconnections (e.g. for cross-over and fanout) will be simpler, and the design difficulties experienced by electrical interconnects at high frequency operations (e.g. transmission line impedance matching or termination) will be overcome. The optoelectronic devices to be interconnected will either by GaAs FET-SEEDs (from AT&T) or VCSELs (from Honeywell) and photodetector arrays with HBT preamplifiers (from Rochwell). In carrying out this demonstration project, NIPT, Inc. will work closely with Dr. Steve Hinterlong, Manager of the Photonic Switching Group at AT&T at Naperville, IL to ensure technical as well as future commercial viability. A supportive letter of collaboration from Dr. Hinterlong is attached.