SBIR/STTR Research Award
Active, Two-Phase, Vibration-Induced Droplet Atomization (VIDA) for High-Heat Flux Advanced Thermal Management Applications
Award amount
$70,000Program and phase
STTR · Phase IAward year
2003Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- Innovative Fluidics, Inc.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
Vibration-Induced Droplet Atomization, or VIDA, is a thin-film spray cooling technology developed at Georgia Tech with tremendous potential for thermal management applications in future Navy ship power electronic systems. The patented VIDA technique uses avibrating piezo driver in a self-contained cell to deliver a highly controllable, rapid-response, on-demand aerosol-sized water spray to hot electronic components. Vapor evaporated from the hot surface condenses on a secondary cooling loop, thus enablingefficient heat removal. Results show that a small charge can effectively manage high power densities with an extremely low ratio of power consumed to power removed and with very low flow rates. Through use of a small piezo pump, the system can be madeorientation-independent. Cooling rates in excess of 100W/cm2 have been measured while keeping devices below 125C. It is anticipated the technique can be developed to deliver up to 1000 W/cm2 with optimizations described herein. The VIDA technology has thepotential for delivering a method of high heat-flux thermal management in a relatively simple, low-cost configuration, in a low-profile form factor. Military applications include solid-state power electronic conversion and distribution systems; as well ascooling of radar, high-power laser, electromagnetic aircraft launch, electromagnetic weapon systems and motor speed controllers. Commercial applications include cooling of lasers for optoelectronic switching and telecommunications systems as well ashigh-power rack mount and blade servers and high-temperature under-the-hood electronics.
Technology keywords
Not reported