Packaging for Radio Frequency Microelectronic (MEMS) Devices Subjected to Harsh Environments

The objective of this Small Business Innovation Research (SBIR) project is to investigate the development of durable, low-cost, Level 1 packaging schemes for RF MEMS devices so that they can withstand extreme loading (mechanical/thermal) conditions and theharsh environment of the battlefield. Our approach will incorporate design and fabrication of three-dimensional interconnects for low-loss and excellent RF performance along with a hermetic on-wafer packaging architecture utilizing Si micromachining andthermo-compression gold bonding. Such a packaging technique offers the optimal approach to highly integrated multifunctional RF systems. In the Phase I feasibility study, we will conduct a research and development program in order to identify materials andtechnologies for the design of RF MEMS packaging and interconnects such that they will withstand extreme conditions. The research during Phase I will include a theoretical analysis to predict deformation, fracture and failure of both the devices and thepackaging seal as well as experimental verification of some of the concepts proposed. One the major problems with the commercial application of RF MEMS devices is their packaging. The outcome of this SBIR project will herald reliable packaging schemes forRF MEMS systems for both military and commercial communication and sensing systems.