SBIR/STTR Research Award
Thermal Management Techniques for Bonded Electronic Components
Award amount
$69,960Program and phase
SBIR · Phase IAward year
2002Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- ATS-MER, LLC
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- F8HABDW7DVG8
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
"This SBIR Phase I seeks to develop a family of unique highly thermally conductive diamond/epoxy composite adhesives for die attach of power electronic devices. Diamond has a conductivity of above 1800 W/m.K as compared to the conventional epoxy matrixwith a conductivity of 0.2 W/m.K. Hence the incorporation of the diamond filler particles with volume loading, Vf>50% can greatly increase the conductivity of the epoxy matrix to levels above 20-50 W/m.K, whilst retaining high bond strength and ease ofapplication. The most key innovation is to tailor the interface of the diamond particulate filler to allow acoustic coupling with the epoxy matrix for high conductivity by use of coating of the diamond with intermediate acoustic impedance layers with useof self-assembly coupling agents. High conductivity adhesives are essential for heat management in modern power electronic devices. The proposed innovation of using diamond filler will make thermal adhesives specifically for commercial high heat fluxapplications."
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- AM of Layered Structures
- Large Parts Additive Manufacturing
- High Value Carbon Products from Domestic Coal
- Ultra-lightweight Lubrication Free Hybrid Carbon Composite Ring-less Piston Engines for Remotely Piloted Aircraft
- Solid State Non-powder Process for Boron Nitride Nanotube Metal Matrix Composite
Research funding history
464 SBIR/STTR records share this UEI (1985–2018). Reported award amounts total $100,117,977. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, National Science Foundation, Environmental Protection Agency, Department of Transportation