An Expert System for Design of Plastic IC Packages Against Latent Moisture-Induced Defects

A feasibility study of developing an expert design system for plastic integrated circuit packages against latent moisture-induced defects is proposed. Moisture-induced cracking of the package is one common type of latent defect incurred during board assembly. Heat transfer, moisture diffusion, moisture vaporization, thermal stress, hydro stress, and fracture mechanics will be employed in the expert system to model the popcorn phenomenon of plastic packages. Propagation of the vaporization front within the plastic packages will also be considered. Industry records on plastic package popcorn failures will be collected and used to check and calibrate the model. Finite element method will be used to similate the popcorn phenomenon. OPTION TASK: None submitted.