Model-based Beam-time Arrival Matching

Not Available This Small Business Innovation Research project proposes the development of novel technology for asynchronous 20 Gb/s data transmission between chips mounted on a superconducting multi-chip module (MCM). In spite of demonstrated advantages in high speed, low power-consumption and high accuracy, commercialization of superconducting electronic systems are retarded by fabrication technology limitations, such as low yield and uniformity. Modularization of a complex circuit into smaller blocks, fabricated on separate chips and mounted on a common carrier, circumvents this limitation and improves reliability. While individual circuit blocks have been demonstrated to operate at 20 Gb/s and beyond, present interchip data transmission rates limit operation of these large circuits to less than 5 GHz clock speed. In order to take full advantage of superconducting digital technology, interchip data rates above 20 Gb/s must be achieved. In Phase I, 20 Gb/s data transfer through non-superconducting solder bumps and passive transmission lines on the MCM carrier will be demonstrated, using digital logic to eliminate the need for amplification and avoid bandwidth limitations of transmission lines. In Phase II, HYPRES will increase this interconnect speed to 30 Gb/s and use this novel MCM technology to develop digital receiver components.