Integration Concepts for Space IR Sensing Component Technologies

SSG proposes the development of a dual-octave, hyperspectral sensor, comprising a dual-band focal plane array and an innovative instrument concept for dual-band dispersive optics. The instrument concept proposed combines an innovative Grating ImagingSpectrometer (GIS) instrument concept with ultralightweight Silicon Carbide (SiC) materials to provide a novel optical system payload which addresses some of the critical requirements associated with next generation surveillance missions. SSG's innovativepayload solution can be combined with other AFRL technology developments, specifically with high temperature, dual-band FPAs (DRS Technology) and compact, low-power drive electronics (Nova Research), to provide an instrument concept with several benefits:reduced mass from the application of SiC materials, an innovative, multifunction sensor design, and the benefits associated with the dual-band FPA and drive electronics developments; improved thermal stability from the material property advantagesassociated with SiC and from the elimination of dichroics or beamsplitters which is allowed by the dual-band IR FPA; and reduced costs associated with a reduced payload mass. In the work proposed here SSG will further develop the instrument concept,providing a conceptual opto-mechanical design, a detailed optical design, and a manufacturing plan which can be used to produce a prototype in Phase II. Interaction with AFRL, DRS, and Nova Research personnel will be critical to a successful effort.Thehyperspectral imaging sensor concept proposed has a number of government and commercial applications in the area of remote sensing. Hyperspectral imaging for agri-business applications is a good example. In addition the silicon carbide materials used inour sensor can be applied directly to a number of commercial industrial needs, including lightweight, thermally stable components for semiconductor capital equipment applications.