On-Chip Optical Interconnector

The objective of this proposed SBIR phase I work is to design, build and therefore demonstrate the feasibility of an on-chip optical interconnector. This proposed device contains a molded plastic optical connector, a fiber ribbon, an on-chip opticalreceptacle, VCSEL, PIN diode (arrays for multiple-channel applications), and necessary electronic circuits, all in one compact unit. The design targets high bandwidth, low-cross talk, and low mechanical profile for on-chip implementation in today¿_s andnext generation high-performance computing systems. This device is expected to open up a new avenue for data communication and link between, e.g., central processing unit (CPU) and its peripheral counterparts at a speed and bandwidth otherwise impossiblewith the traditional printed circuit board (PCB). The proprietary design of this optical interconnector allows easy reconfiguration and manufacturing at low cost. With its superior data-link performance, the device is expected to find critical applicationsin a wide range of computing and smart electronics systems. The proposed on-chip optical interconnector is expected to find both commercial and military applications in a wide range of computing and smart electronics systems.