Two-Dimensional Ultrasonic Imaging Array Transducer

In this proposal, new fabrication techniques for high density 2D medical ultrasound arrays will be developed. These techniques will allow for the construction of 10 to 50 MHz arrays with very high element counts, complex 2D geometries, and much smaller structures than can be effectively fabricated today using traditional dicing saw techniques. The proposed fabrication method represents a significant departure from traditional approaches and incorporates new micromachining and interconnection technologies to allow for the creation of complex geometries and dense interconnection to passive or active substrates. This technology will lead to significant improvements in invasive or minimally invasive ultrasound arrays where the performance to date has been substandard due to manufacturing processes which allow for only low element counts and limited feature delineation. During Phase I of the proposed research, a 10 x 10 (100 element), 2D 10 MHz array will be designed, fabricated and characterized. This array will have kerf widths of less than 10 micons. Performance of the array will be compared to theoretical models. Phase II of theis research will extend this effort to a complete transducer and breadboard imaging system.